2.4 Ghz Intel T7700 Merom Core 2 Duo 35w Draw
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Intel® Core™2 Duo Processor T7700
Specifications
Ordering and Compliance
Retired and discontinued
Intel® Core™2 Duo Processor T7700 (4M Cache, 2.40 GHz, 800 MHz FSB) uFCBGA, Socket P, Tray
- MM# 888428
- Spec Code SLA3M
- Ordering Code LE80537GG0564M
- Shipping Media TRAY
- Stepping E1
Intel® Core™2 Duo Processor T7700 (4M Cache, 2.40 GHz, 800 MHz FSB) uFCPGA, Socket P, Tray
- MM# 888434
- Spec Code SLA43
- Ordering Code LF80537GG0564M
- Shipping Media TRAY
- Stepping E1
Boxed Intel® Core™2 Duo Processor T7700 (4M Cache, 2.40 GHz, 800 MHz FSB) uFCPGA, Socket P
- MM# 890085
- Spec Code SLA43
- Ordering Code BX80537T7700
- Shipping Media BOX
- Stepping E1
Intel® Core™2 Duo Processor T7700 (4M Cache, 2.40 GHz, 800 MHz FSB) uFCPGA, Socket P, Tray
- MM# 891085
- Spec Code SLAF7
- Ordering Code LF80537GG0564M
- Shipping Media TRAY
- Stepping G0
Intel® Core™2 Duo Processor T7700 (4M Cache, 2.40 GHz, 800 MHz FSB) uFCBGA, Socket P, Tray
- MM# 891312
- Spec Code SLADL
- Ordering Code LE80537GG0564M
- Shipping Media TRAY
- Stepping G0
Boxed Intel® Core™2 Duo Processor T7700 (4M Cache, 2.40 GHz, 800 MHz FSB) uFCPGA, Socket P
- MM# 894486
- Spec Code SLAF7
- Ordering Code BX80537T7700
- Shipping Media BOX
- Stepping G0
Trade compliance information
- ECCN 3A991.A.1
- CCATS NA
- US HTS 8542310001
PCN/MDDS Information
Product Images
Compatible Products
Intel® 960 Series Chipsets
Drivers and Software
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Name
Technical Documentation
Launch Date
The date the product was first introduced.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Cache
CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
Bus Speed
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer's motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.
FSB Parity
FSB parity provides error checking on data sent on the FSB (Front Side Bus).
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Embedded Options Available
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.
Sockets Supported
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
TJUNCTION
Junction Temperature is the maximum temperature allowed at the processor die.
Intel® Turbo Boost Technology ‡
Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don't.
Intel® Hyper-Threading Technology ‡
Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.
Intel® Virtualization Technology (VT-x) ‡
Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple "virtual" platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
Intel® 64 ‡
Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel's instruction set this processor is compatible with.
Idle States
Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Enhanced Intel SpeedStep® Technology
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Intel® Demand Based Switching
Intel® Demand Based Switching is a power-management technology in which the applied voltage and clock speed of a microprocessor are kept at the minimum necessary levels until more processing power is required. This technology was introduced as Intel SpeedStep® Technology in the server marketplace.
Intel® Trusted Execution Technology ‡
Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.
Execute Disable Bit ‡
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.
Tray Processor
Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn't provide direct warranty support. Contact your OEM or reseller for warranty support.
What is the difference between Boxed and Tray Processors?
Tray Processor
Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn't provide direct warranty support. Contact your OEM or reseller for warranty support.
What is the difference between Boxed and Tray Processors?
Tray Processor
Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn't provide direct warranty support. Contact your OEM or reseller for warranty support.
What is the difference between Boxed and Tray Processors?
Tray Processor
Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn't provide direct warranty support. Contact your OEM or reseller for warranty support.
What is the difference between Boxed and Tray Processors?
More support options for Intel® Core™2 Duo Processor T7700 (4M Cache, 2.40 GHz, 800 MHz FSB)
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Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
"Announced" SKUs are not yet available. Please refer to the Launch Date for market availability.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/content/www/us/en/processors/processor-numbers.html for details.
See http://www.intel.com/content/www/us/en/architecture-and-technology/hyper-threading/hyper-threading-technology.html?wapkw=hyper+threading for more information including details on which processors support Intel® HT Technology.
Max Turbo Frequency refers to the maximum single-core processor frequency that can be achieved with Intel® Turbo Boost Technology. See www.intel.com/technology/turboboost/ for more information and applicability of this technology.
Processors that support 64-bit computing on Intel® architecture require an Intel 64 architecture-enabled BIOS.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
2.4 Ghz Intel T7700 Merom Core 2 Duo 35w Draw
Source: https://ark.intel.com/content/www/us/en/ark/products/29762/intel-core2-duo-processor-t7700-4m-cache-2-40-ghz-800-mhz-fsb.html
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